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Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive
  • PDF
  • English
  • Year: 2002
  • Author: John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
  • DJVU
  • English
  • Year: 1999
  • Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
  • DJVU
  • English
  • Year: 1999
  • Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
  • PDF
  • English
  • Year: 2002
  • Author: Ning-Cheng Lee
Reflow Soldering Processes
  • PDF
  • English
  • Year: 2002
  • Author: Ning-Cheng Lee PhD
Advanced MEMS Packaging (Electronic Engineering)
  • PDF
  • English
  • Year: 2009
  • Author: John Lau, Cheng Lee, C. Premachandran, Yu Aibin
Essentials of Excel VBA, Python, and R: Volume I: Financial Statistics and Portfolio Analysis
  • EPUB
  • English
  • Year: 2023
  • Author: John Lee; Cheng-Few Lee
The Wealth Dragon Way: The Why, the When and the How to Become Infinitely Wealthy
  • EPUB
  • English
  • Year: 2019
  • Author: John Lee; Vincent Wong
The wealth dragon way: the why, the when and the how to become infinitely wealthy
  • EPUB
  • English
  • Year: 2015
  • Author: John Lee & Vincent Wong
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