Microvias: For Low Cost, High Density Interconnects
- Author
- John H. Lau, S.W. Ricky Lee
- Publisher
- McGraw-Hill Professional
- Language
- English
- Edition
- 1
- Year
- 2001
- Page
- 549
- ISBN
- 9780071363273,0071363270
- File Type
- pdf
- File Size
- 11.5 MiB
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