Chip Scale Package: Design, Materials, Process, Reliability, and Applications
- Author
- John H. Lau, Ricky S.W. Lee, Ricky S. Lee
- Publisher
- McGraw-Hill Professional
- Language
- English
- Edition
- 1
- Year
- 1999
- Page
- 570
- ISBN
- 0070383049,9780070383043
- File Type
- djvu
- File Size
- 7.7 MiB
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