Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
- Author
- Ning-Cheng Lee
- Publisher
- Newnes
- Language
- English
- Year
- 2002
- Page
- 273
- ISBN
- 9780080492247,008049224X
- File Type
- pdf
- File Size
- 12.6 MiB
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