Home Advanced Search

Advanced Search - Page 1

Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
3D IC Integration and Packaging (Electronics)
3D IC Integration and Packaging (Electronics)
  • PDF
  • English
  • Year: 2015
  • Author: John Lau
Diseño de accesorios
Diseño de accesorios
  • PDF
  • Spanish
  • Year: 2013
  • Author: John Lau
Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
Wedding feng shui: the Chinese horoscopes guide to planning your wedding
Wedding feng shui: the Chinese horoscopes guide to planning your wedding
  • EPUB
  • English
  • Year: 2011
  • Author: Lau, Laura;Lau, Theodora
Luther
Luther
  • PDF
  • English
  • Year: 1959
  • Author: Franz Lau; Robert H. Fischer