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Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
  • DJVU
  • English
  • Year: 2000
  • Author: John H. Lau
Flip Chip Technologies
  • DJVU
  • English
  • Year: 1995
  • Author: John H. Lau
Thermal Stress and Strain in Microelectronics Packaging
  • PDF
  • English
  • Year: 1993
  • Author: John H. Lau (auth.), John H. Lau PhD, PE (eds.)
Advanced MEMS packaging
  • PDF
  • English
  • Year: 2010
  • Author: John H. Lau ... [et al.]
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
Diseño de accesorios
  • PDF
  • Spanish
  • Year: 2013
  • Author: John Lau
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