Thermal Stress and Strain in Microelectronics Packaging
- Author
- John H. Lau (auth.), John H. Lau PhD, PE (eds.)
- Publisher
- Springer US
- Language
- English
- Edition
- 1
- Year
- 1993
- Page
- 884
- ISBN
- 978-1-4684-7769-6,978-1-4684-7767-2
- File Type
- pdf
- File Size
- 26.4 MiB
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