Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
- Author
- John H. Lau
- Publisher
- McGraw-Hill Professional
- Language
- English
- Edition
- 1
- Year
- 2000
- Page
- 602
- ISBN
- 0071351418,9780071351416
- File Type
- djvu
- File Size
- 8.4 MiB
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