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Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
Essentials of Excel VBA, Python, and R: Volume I: Financial Statistics and Portfolio Analysis
Essentials of Excel VBA, Python, and R: Volume I: Financial Statistics and Portfolio Analysis
  • EPUB
  • English
  • Year: 2023
  • Author: John Lee; Cheng-Few Lee
Recycling of thermoplastic composites
Recycling of thermoplastic composites
  • PDF
  • English
  • Year: 2022
  • Author: Ning H.
Handbook of Financial Econometrics, Mathematics, Statistics, and Machine Learning (in 4 Volumes)
Handbook of Financial Econometrics, Mathematics, Statistics, and Machine Learning (in 4 Volumes)
  • PDF
  • English
  • Year: 2021
  • Author: Cheng F. Lee; John C Lee
3D IC Integration and Packaging (Electronics)
3D IC Integration and Packaging (Electronics)
  • PDF
  • English
  • Year: 2015
  • Author: John Lau
Diseño de accesorios
Diseño de accesorios
  • PDF
  • Spanish
  • Year: 2013
  • Author: John Lau
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