Home Advanced Search

Advanced Search - Page 1

Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
  • PDF
  • English
  • Year: 2002
  • Author: Ning-Cheng Lee
Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
  • DJVU
  • English
  • Year: 2000
  • Author: John H. Lau
Flip Chip Technologies
  • DJVU
  • English
  • Year: 1995
  • Author: John H. Lau
Essentials of Excel VBA, Python, and R: Volume I: Financial Statistics and Portfolio Analysis
  • EPUB
  • English
  • Year: 2023
  • Author: John Lee; Cheng-Few Lee
Handbook of Financial Econometrics, Mathematics, Statistics, and Machine Learning (in 4 Volumes)
  • PDF
  • English
  • Year: 2021
  • Author: Cheng F. Lee; John C Lee
search