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Diseño de accesorios
  • PDF
  • Spanish
  • Year: 2013
  • Author: John Lau
3D IC Integration and Packaging (Electronics)
  • PDF
  • English
  • Year: 2015
  • Author: John Lau
Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
  • DJVU
  • English
  • Year: 2000
  • Author: John H. Lau
Flip Chip Technologies
  • DJVU
  • English
  • Year: 1995
  • Author: John H. Lau
Classical Chinese Literature: An Anthology of Translations - Volume I: From Antiquity to the Tang Dynasty
  • PDF
  • English
  • Year: 2000
  • Author: John Minford; Joseph S.M. Lau
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
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