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Microvias: For Low Cost, High Density Interconnects
  • PDF
  • English
  • Year: 2001
  • Author: John H. Lau, S.W. Ricky Lee
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
  • DJVU
  • English
  • Year: 1999
  • Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
  • DJVU
  • English
  • Year: 1999
  • Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
Solder joint reliability
  • PDF
  • English
  • Year: 2004
  • Author: Ricky Lee S.W.
Electronics Manufacturing with Lead-Free Halogen-Free and Conductive-Adhesive
  • PDF
  • English
  • Year: 2002
  • Author: John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
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