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Chip Scale Package: Design, Materials, Process, Reliability, and Applications
  • DJVU
  • English
  • Year: 1999
  • Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
  • DJVU
  • English
  • Year: 1999
  • Author: John H. Lau, Ricky S.W. Lee, Ricky S. Lee
Solder joint reliability
  • PDF
  • English
  • Year: 2004
  • Author: Ricky Lee S.W.
Law and regulation of commercial mining of minerals in outer space
  • PDF
  • English
  • Year: 2012
  • Author: Ricky Lee (auth.)
From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications
  • PDF
  • English
  • Year: 2021
  • Author: S. W. Ricky Lee, Jeffery C. C. Lo
Assembly and Reliability of Lead-Free Solder Joints
  • PDF
  • English
  • Year: 2020
  • Author: John H. Lau, Ning-Cheng Lee
The Gas Dynamics of Explosions
  • PDF
  • English
  • Year: 2016
  • Author: John H. S. Lee
The Detonation Phenomenon
  • PDF
  • English
  • Year: 2008
  • Author: John H. S. Lee
The Detonation Phenomenon
  • PDF
  • English
  • Year: 2008
  • Author: John H. S. Lee
Wireless Internet and Mobile Computing: Interoperability and Performance (Information and Communication Technology Series,)
  • PDF
  • English
  • Year: 2007
  • Author: Yu-Kwong Ricky Kwok, Vincent K.N. Lau
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