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Solder Joint Reliability: Theory and Applications
  • PDF
  • English
  • Year: 1991
  • Author: Colin MacKay (auth.), John H. Lau (eds.)
Thermal Stress and Strain in Microelectronics Packaging
  • PDF
  • English
  • Year: 1993
  • Author: John H. Lau (auth.), John H. Lau PhD, PE (eds.)
Fan-Out Wafer-Level Packaging
  • PDF
  • English
  • Year: 2018
  • Author: John H. Lau
Heterogeneous Integrations
  • PDF
  • English
  • Year: 2019
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • PDF
  • English
  • Year: 2023
  • Author: John H. Lau
Chiplet Design and Heterogeneous Integration Packaging
  • EPUB
  • English
  • Year: 2023
  • Author: John H. Lau
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
  • DJVU
  • English
  • Year: 2000
  • Author: John H. Lau
Flip Chip Technologies
  • DJVU
  • English
  • Year: 1995
  • Author: John H. Lau
Electronics Packaging Forum: Volume Two
  • PDF
  • English
  • Year: 1990
  • Author: John H. Lau, Steve J. Erasmus, Donald W. Rice (auth.), James E. Morris (eds.)
Protocols for Nucleic Acid Analysis by Nonradioactive Probes
  • PDF
  • English
  • Year: 2007
  • Author: Duckchul Park (auth.), Elena Hilario, John Mackay (eds.)
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