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Cracking failures in lead-on-chip packages induced by chip backside contamination :MASAZUMI AMAGAI, HIDEO SENO and KAZUYOSHI EBE. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 119 (February 1995)
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  • English
Husserl
  • PDF
  • Italian
  • Year: 2009
  • Author: Vincenzo Costa
Heterogeneous Catalysts for Clean Technology: Spectroscopy, Design, and Monitoring
  • PDF
  • English
  • Year: 2013
  • Author: Karen Wilson, Adam F. Lee
The Valuation of Financial Companies: Tools and Techniques to Measure the Value of Banks, Insurance Companies and Other Financial Institutions
  • PDF
  • English
  • Year: 2014
  • Author: Mario Massari, Gianfranco Gianfrate, Laura Zanetti
Innate Inflammation and Stroke
  • PDF
  • English
  • Year: 2010
  • Author: Wolfgang Eisert, Gregory J. del Zoppo, Philip B. Gorelick
Adapting High Hydrostatic Pressure
  • EPUB
  • English
  • Year: 2014
  • Author: Tatiana Koutchma
High-Entropy Alloys
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  • English
  • Year: 2014
  • Author: B.S. Murty Ph.D., Jien-Wei Yeh Ph.D., S. Ranganathan Ph.D.
China's Strategic Interests in the South China Sea: Power and Resources
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  • English
  • Year: 2013
  • Author: Sigfrido Burgos Cáceres
The everyday pocket handbook for visual inspection and weld discontinuities-- causes and remedies
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  • English
  • Year: 2000
  • Author: Ted V Weber; American Welding Society. Product Development Committee
Drugged: The Science and Culture Behind Psychotropic Drugs
  • MOBI
  • English
  • Year: 2013
  • Author: Richard J. Miller
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