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TSV 3D RF Integration: High Resistivity Si Interposer Technology
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  • English
  • Year: 2022
  • Author: Shenglin Ma, Yufeng Jin
Introduction to microsystem packaging technology
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  • English
  • Year: 2011
  • Author: Yufeng Jin; Zhiping Wang; Jing Chen
Device-to-Device based Proximity Service: Architecture, Issues, and Applications
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  • English
  • Year: 2017
  • Author: Yufeng Wang, Athanasios V. Vasilakos, Qun Jin, Hongbo Zhu
Device-to-Device based Proximity Service : Architecture, Issues, and Applications
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  • English
  • Year: 2017
  • Author: Yufeng Wang, Athanasios V. Vasilakos, Qun Jin, Hongbo Zhu
Topology Design of Robot Mechanisms
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  • English
  • Year: 2018
  • Author: Ting-Li Yang,Anxin Liu,Huiping Shen,LuBin Hang,Yufeng Luo,Qiong Jin (auth.)
Magnesium Alloys as Degradable Biomaterials
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  • English
  • Year: 2015
  • Author: Yufeng Zheng
.An Efficient Nondissipative Higher-Order Single-Step Integration Method for Long-Term Dynamics Simulation
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  • English
  • Author: Yufeng, Xing, Huimin, Zhang
Collaborative Perception, Localization and Mapping for Autonomous Systems
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  • Year: 2020
  • Author: Yufeng Yue, Danwei Wang
Collaborative Perception, Localization and Mapping for Autonomous Systems
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  • English
  • Year: 2021
  • Author: Yufeng Yue, Danwei Wang
Mobile Social Networking and Computing: A Multidisciplinary Integrated Perspective
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  • English
  • Year: 2014
  • Author: Yufeng Wang, Jianhua Ma
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