TSV 3D RF Integration: High Resistivity Si Interposer Technology
- Author
- Shenglin Ma, Yufeng Jin
- Publisher
- Elsevier
- Language
- English
- Edition
- 1
- Year
- 2022
- Page
- 292
- ISBN
- 0323996027,9780323996020
- File Type
- pdf
- File Size
- 20.5 MiB
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