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TSV 3D RF Integration: High Resistivity Si Interposer Technology
  • PDF
  • English
  • Year: 2022
  • Author: Shenglin Ma, Yufeng Jin
Mobile Social Networking and Computing: A Multidisciplinary Integrated Perspective
  • PDF
  • English
  • Year: 2014
  • Author: Yufeng Wang, Jianhua Ma
Introduction to microsystem packaging technology
  • PDF
  • English
  • Year: 2011
  • Author: Yufeng Jin; Zhiping Wang; Jing Chen
Device-to-Device based Proximity Service: Architecture, Issues, and Applications
  • AZW3
  • English
  • Year: 2017
  • Author: Yufeng Wang, Athanasios V. Vasilakos, Qun Jin, Hongbo Zhu
Device-to-Device based Proximity Service : Architecture, Issues, and Applications
  • PDF
  • English
  • Year: 2017
  • Author: Yufeng Wang, Athanasios V. Vasilakos, Qun Jin, Hongbo Zhu
Chinese Plants Names Index 2000-2009
  • PDF
  • English
  • Year: 2021
  • Author: Cheng DU; Jin-shuang MA
Chinese Plants Names Index 2010-2017
  • PDF
  • English
  • Year: 2021
  • Author: Cheng DU; Jin-shuang MA
Forward-Backward Stochastic Differential Equations and their Applications
  • DJVU
  • English
  • Year: 2007
  • Author: Jin Ma, Jiongmin Yong (auth.)
The Global Silicon Valley Home: Lives and Landscapes Within Taiwanese American Trans-Pacific Culture
  • PDF
  • English
  • Year: 2022
  • Author: Shenglin Chang
Topology Design of Robot Mechanisms
  • PDF
  • English
  • Year: 2018
  • Author: Ting-Li Yang,Anxin Liu,Huiping Shen,LuBin Hang,Yufeng Luo,Qiong Jin (auth.)
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