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TSV 3D RF Integration: High Resistivity Si Interposer Technology
TSV 3D RF Integration: High Resistivity Si Interposer Technology
  • PDF
  • English
  • Year: 2022
  • Author: Shenglin Ma, Yufeng Jin
Chinese Plants Names Index 2000-2009
Chinese Plants Names Index 2000-2009
  • PDF
  • English
  • Year: 2021
  • Author: Cheng DU; Jin-shuang MA
Chinese Plants Names Index 2010-2017
Chinese Plants Names Index 2010-2017
  • PDF
  • English
  • Year: 2021
  • Author: Cheng DU; Jin-shuang MA
Annual Report on China’s Petroleum, Gas and New Energy Industry (2021)
Annual Report on China’s Petroleum, Gas and New Energy Industry (2021)
  • PDF
  • English
  • Year: 2022
  • Author: Fang Cai, Yongsheng Ma, Zhijun Jin
Device-to-Device based Proximity Service : Architecture, Issues, and Applications
Device-to-Device based Proximity Service : Architecture, Issues, and Applications
  • PDF
  • English
  • Year: 2017
  • Author: Yufeng Wang, Athanasios V. Vasilakos, Qun Jin, Hongbo Zhu
Device-to-Device based Proximity Service: Architecture, Issues, and Applications
Device-to-Device based Proximity Service: Architecture, Issues, and Applications
  • AZW3
  • English
  • Year: 2017
  • Author: Yufeng Wang, Athanasios V. Vasilakos, Qun Jin, Hongbo Zhu
Collaborative Perception, Localization and Mapping for Autonomous Systems
Collaborative Perception, Localization and Mapping for Autonomous Systems
  • PDF
  • English
  • Year: 2021
  • Author: Yufeng Yue, Danwei Wang
Collaborative Perception, Localization and Mapping for Autonomous Systems
Collaborative Perception, Localization and Mapping for Autonomous Systems
  • PDF
  • English
  • Year: 2020
  • Author: Yufeng Yue, Danwei Wang