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Advanced Flip Chip Packaging
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  • Year: 2013
  • Author: Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)
Nano-Bio- Electronic, Photonic and MEMS Packaging
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  • Year: 2010
  • Author: C. P. Wong, Kyoung-sik (Jack) Moon (auth.), C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li (eds.)
Nano-Bio- Electronic, Photonic and MEMS Packaging
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  • English
  • Year: 2010
  • Author: C. P. Wong, Kyoung-sik (Jack) Moon (auth.), C.P. Wong, Kyoung-Sik Moon, Yi (Grace) Li (eds.)
Materials for Advanced Packaging
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  • Year: 2009
  • Author: Rajen Chanchani (auth.), Daniel Lu, C.P. Wong (eds.)
Materials For Advanced Packaging
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  • Year: 2009
  • Author: Rajen Chanchani (auth.), Daniel Lu, C.P. Wong (eds.)
Water Science & Technology in China: A Roadmap to 2050
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  • Year: 2012
  • Author: Changming Liu, Mingan Shao, Yi Wang (auth.), Changming Liu, Mingan Shao, Yi Wang, Xiyong Hou (eds.)
Water Science & Technology in China: A Roadmap to 2050
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  • Year: 2012
  • Author: Changming Liu, Mingan Shao, Yi Wang (auth.), Changming Liu, Mingan Shao, Yi Wang, Xiyong Hou (eds.)
Materials for Advanced Packaging
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  • Year: 2016
  • Author: Daniel Lu, C.P. Wong (eds.)
Elemental Sulfur und Sulfur-Rich Compounds II
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  • Year: 2003
  • Author: Ming Wah Wong (auth.), Ralf Steudel (eds.)
Elemental Sulfur und Sulfur-Rich Compounds II
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  • English
  • Year: 2003
  • Author: Ming Wah Wong (auth.), Ralf Steudel (eds.)
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