Advanced Flip Chip Packaging
- Author
- Robert Lanzone (auth.), Ho-Ming Tong, Yi-Shao Lai, C.P. Wong (eds.)
- Publisher
- Springer US
- Language
- English
- Edition
- 1
- Year
- 2013
- Page
- 560
- ISBN
- 978-1-4419-5767-2,978-1-4419-5768-9
- File Type
- pdf
- File Size
- 21.8 MiB
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