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RF and Microwave Microelectronics Packaging
  • PDF
  • English
  • Year: 2010
  • Author: Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
RF and Microwave Microelectronics Packaging
  • PDF
  • English
  • Year: 2010
  • Author: Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
RF and Microwave Microelectronics Packaging
  • PDF
  • English
  • Year: 2010
  • Author: Rick Sturdivant (auth.), Ken Kuang, Franklin Kim, Sean S. Cahill (eds.)
RF and Microwave Microelectronics Packaging II
  • PDF
  • English
  • Year: 2017
  • Author: Ken Kuang, Rick Sturdivant (eds.)
Microwave and millimeter-wave electronic packaging
  • PDF
  • English
  • Year: 2014
  • Author: Sturdivant, Rick
Male Infertility: Problems and Solutions
  • PDF
  • English
  • Year: 2011
  • Author: Wayne Kuang MD (auth.), Edmund S. Sabanegh (eds.)
Advanced Thermal Management Materials
  • PDF
  • English
  • Year: 2013
  • Author: Guosheng Jiang, Liyong Diao, Ken Kuang (auth.)
Applied Logistic Regression
  • PDF
  • English
  • Year: 2013
  • Author: David W. Hosmer, Stanley Lemeshow, Rodney X. Sturdivant (auth.), Walter A. Shewhart, Samuel S. Wilks (eds.)
Transmit Receive Modules for Radar and Communication Systems
  • AZW3
  • English
  • Year: 2016;2015
  • Author: Harris, Mike;Sturdivant, Rick
Fuel Cell Electronics Packaging
  • PDF
  • English
  • Year: 2007
  • Author: Ken Kuang, Keith Easler
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