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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
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  • Year: 2004
  • Author: Jianfeng Luo, David A. Dornfeld (auth.)
Precision Manufacturing
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  • Year: 2008
  • Author: David Dornfeld, Dae-Eun Lee (auth.)
Burrs - Analysis, Control and Removal: Proceedings of the CIRP International Conference on Burrs, 2nd-3rd April, 2009, University of Kaiserslautern, Germany
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  • Year: 2010
  • Author: D. Dornfeld, S. Min (auth.), Jan C. Aurich, David Dornfeld (eds.)
Green Manufacturing: Fundamentals and Applications
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  • Year: 2013
  • Author: David Dornfeld, Chris Yuan, Nancy Diaz, Teresa Zhang (auth.), David A. Dornfeld (eds.)
Leveraging Technology for a Sustainable World: Proceedings of the 19th CIRP Conference on Life Cycle Engineering, University of California at Berkeley, Berkeley, USA, May 23 - 25, 2012
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  • Year: 2012
  • Author: Michael Overcash, Janet Twomey (auth.), David A. Dornfeld, Barbara S. Linke (eds.)
Pain Research: Methods and Protocols
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  • Year: 2012
  • Author: Z. David Luo (auth.), Z. David Luo (eds.)
Contract Theory in Continuous-Time Models
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  • Year: 2013
  • Author: Jakša Cvitanić, Jianfeng Zhang (auth.)
Oxidative Stress in Cancer Biology and Therapy
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  • Year: 2012
  • Author: Iman M. Ahmad PhD, Maher Y. Abdalla PhD (auth.), Douglas R. Spitz, Kenneth J. Dornfeld, Koyamangalath Krishnan, David Gius (eds.)
Pain Research: Methods and Protocols
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  • Year: 2004
  • Author: Z. David Luo
Image-Based Multilevel Biomechanical Modeling for Fall-Induced Hip Fracture
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  • Year: 2017
  • Author: Yunhua Luo (auth.)
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