Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
- Author
- Jianfeng Luo, David A. Dornfeld (auth.)
- Publisher
- Springer-Verlag Berlin Heidelberg
- Language
- English
- Edition
- 1
- Year
- 2004
- Page
- 311
- ISBN
- 978-3-642-06115-8,978-3-662-07928-7
- File Type
- pdf
- File Size
- 12.3 MiB
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