Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales

Author: Jianfeng Luo, David A. Dornfeld (auth.)
Publisher: Springer-Verlag Berlin Heidelberg
Language: English
Edition: 1
Year: 2004
Page: 311
ISBN: 978-3-642-06115-8,978-3-662-07928-7
File Type: pdf
File Size: 12.3 MiB

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