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Semiconductor Packaging: Materials Interaction and Reliability
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  • Year: 2011
  • Author: Andrea Chen, Randy Hsiao-Yu Lo
Semiconductor Packaging: Materials Interaction and Reliability
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  • English
  • Year: 2011
  • Author: Andrea Chen, Randy Hsiao-Yu Lo
The Next Generation CDMA Technologies
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  • Year: 2007
  • Author: Hsiao-Hwa Chen
Globalization and the World of Large Cities
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  • Year: 1998
  • Author: Fu-Chen Lo
Cultural Differences in Chinese and American Address Forms
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  • English
  • Author: Yu Chen.
The Ritual Dimension of Union With Christ in Paul's Thought (Wissenschaftliche Untersuchungen zum Neuen Testament 2. Reihe, 568)
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  • Year: 2022
  • Author: Yu Chen
Tertiary Education at a Glance: China
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  • Year: 2012
  • Author: Kai Yu, Andrea Lynn Stith, Li Liu, Huizhong Chen (auth.), Kai Yu, Andrea Lynn Stith, Li Liu, Huizhong Chen (eds.)
Mobile WiMAX: Toward Broadband Wireless Metropolitan Area Networks
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  • Year: 2007
  • Author: Yan Zhang, Hsiao-Hwa Chen
Next Generation Wireless Systems and Networks
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  • Year: 2006
  • Author: Hsiao-Hwa Chen, Mohsen Guizani
Mobile WiMAX: Toward Broadband Wireless Metropolitan Area Networks
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  • English
  • Year: 2007
  • Author: Yan Zhang, Hsiao-Hwa Chen
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