Semiconductor Packaging: Materials Interaction and Reliability
- Author
- Andrea Chen, Randy Hsiao-Yu Lo
- Publisher
- CRC Press
- Language
- English
- Edition
- 0
- Year
- 2011
- Page
- 216
- ISBN
- 1439862052,9781439862056
- File Type
- pdf
- File Size
- 7.5 MiB
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