Wireless Interface Technologies for 3D IC and Module Integration
- Author
- Tadahiro Kuroda, Wai-Yeung Yip
- Publisher
- Cambridge University Press
- Language
- English
- Edition
- 1
- Year
- 2021
- Page
- 300
- ISBN
- 110884121X,9781108841214
- File Type
- pdf
- File Size
- 33.5 MiB
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