Advanced Materials for Thermal Management of Electronic Packaging
- Author
- Xingcun Colin Tong (auth.)
- Publisher
- Springer-Verlag New York
- Language
- English
- Edition
- 1
- Year
- 2011
- Page
- 618
- ISBN
- 1441977589,9781441977588
- File Type
- pdf
- File Size
- 14.5 MiB
How to Download?!!!
Just click on START button on Telegram Bot