Materials for High-Density Electronic Packaging and Interconnection

Author: Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council
Publisher: National Academies Press
Language: English
Year: 1990
Page: 155
ISBN: 030904233X,9780309042338,9780585143958
File Type: pdf
File Size: 6.4 MiB

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