Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)
- Author
- Ehrenfried Zschech (Editor), Caroline Whelan (Editor), Thomas Mikolajick (Editor)
- Publisher
- Springer
- Language
- English
- Edition
- 1st Edition.
- Year
- 2005
- Page
- 490
- ISBN
- 1852339411,9781852339418,9781846282355
- File Type
- pdf
- File Size
- 13.3 MiB
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