Foldable Flex and Thinned Silicon Multichip Packaging Technology
- Author
- John W. Balde (auth.), John W. Balde (eds.)
- Publisher
- Springer US
- Language
- English
- Edition
- 1
- Year
- 2003
- Page
- 347
- ISBN
- 978-0-7923-7676-7,978-1-4615-0231-9
- File Type
- pdf
- File Size
- 13.6 MiB
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