Microelectronics Packaging Handbook: Semiconductor Packaging
- Author
- Eugene J. Rymaszewski, Rao R. Tummala, Toshihiko Watari (auth.), Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (eds.)
- Publisher
- Springer US
- Language
- English
- Year
- 1997
- Page
- LXX, 1030 p.
- ISBN
- 978-0-412-08441-6,978-1-4615-6037-1,0-412-08431-7
- File Type
- pdf
- File Size
- 28.0 MiB
How to Download?!!!
Just click on START button on Telegram Bot