Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development
- Author
- Way Kuo, Wei-Ting Kary Chien, Taeho Kim (auth.)
- Publisher
- Springer US
- Language
- English
- Edition
- 1
- Year
- 1998
- Page
- 394
- ISBN
- 978-0-7923-8107-5,978-1-4615-5671-8
- File Type
- pdf
- File Size
- 26.3 MiB
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