3D Microelectronic Packaging: From Architectures to Applications
- Author
- Yan LiDeepak Goyal
- Publisher
- Springer Nature
- Language
- English
- Year
- 2020
- Page
- 622
- ISBN
- 9789811570902,9789811570896,9811570906
- File Type
- epub
- File Size
- 214.5 MiB
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