Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
- Author
- Yong Liu (auth.)
- Publisher
- Springer-Verlag New York
- Language
- English
- Edition
- 1
- Year
- 2012
- Page
- 594
- ISBN
- 9781461410539,1461410533
- File Type
- pdf
- File Size
- 26.1 MiB
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