The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
- Author
- Dr. Gerard Kelly (auth.)
- Publisher
- Springer US
- Language
- English
- Edition
- 1
- Year
- 1999
- Page
- 134
- ISBN
- 978-1-4613-7276-9,978-1-4615-5011-2
- File Type
- pdf
- File Size
- 6.0 MiB
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