Microelectronics Packaging Handbook: Technology Drivers Part I
- Author
- Eugene J. Rymaszewski, Rao R. Tummala, Toshihiko Watari (auth.), Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (eds.)
- Publisher
- Springer US
- Language
- English
- Edition
- 2
- Year
- 1997
- Page
- 720
- ISBN
- 978-1-4613-6829-8,978-1-4615-4086-1
- File Type
- pdf
- File Size
- 43.9 MiB
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