Solder Joint Reliability Prediction for Multiple Environments

Author
Andrew E. Perkins, Suresh K. Sitaraman (auth.)
Publisher
Springer US
Language
English
Edition
1
Year
2009
Page
192
ISBN
978-0-387-79393-1,978-0-387-79394-8
File Type
pdf
File Size
3.5 MiB

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