Wafer Bonding: Applications and Technology
- Author
- J. Haisma (auth.), Dr. Marin Alexe, Prof. Dr. Ulrich Gösele (eds.)
- Publisher
- Springer-Verlag Berlin Heidelberg
- Language
- English
- Edition
- 1
- Year
- 2004
- Page
- 504
- ISBN
- 978-3-642-05915-5,978-3-662-10827-7
- File Type
- pdf
- File Size
- 18.9 MiB
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