Designing TSVs for 3D Integrated Circuits
- Author
- Nauman Khan, Soha Hassoun (auth.)
- Publisher
- Springer-Verlag New York
- Language
- English
- Edition
- 1
- Year
- 2013
- Page
- 76
- ISBN
- 978-1-4614-5507-3,978-1-4614-5508-0
- File Type
- pdf
- File Size
- 1.7 MiB
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