Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
- Author
- Dipl. Ing. Bernd Schwarz (auth.), Dr. G. Q. Zhang, Dr. L. J. Ernst, Mr. O. de Saint Leger (eds.)
- Publisher
- Springer US
- Language
- English
- Edition
- 1
- Year
- 2000
- Page
- 192
- ISBN
- 978-1-4419-4873-1,978-1-4757-3159-0
- File Type
- pdf
- File Size
- 7.1 MiB
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