Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
- Author
- Er?Ping Li(auth.), Lajos Hanzo(eds.)
- Publisher
- Wiley-IEEE Press
- Language
- English
- Year
- 2012
- Page
- 387
- ISBN
- 9780470623466,9781118166727
- File Type
- pdf
- File Size
- 4.1 MiB
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