Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
- Author
- Sheng Liu, Yong Liu(auth.)
- Language
- English
- Year
- 2011
- Page
- 566
- ISBN
- 9780470827802,9780470827826
- File Type
- pdf
- File Size
- 17.8 MiB
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