Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Author: Sheng Liu, Yong Liu(auth.)
Language: English
Year: 2011
Page: 566
ISBN: 9780470827802,9780470827826
File Type: pdf
File Size: 17.8 MiB

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