Cu Organocopper Compounds: Index Empirical Formula Index and Ligand Formula Index for Parts 1 to 4

Author
Johannes Füssel (auth.), Johannes Füssel (eds.)
Publisher
Springer-Verlag Berlin Heidelberg
Language
English
Edition
8
Year
1987
Page
244
ISBN
978-3-662-11663-0,978-3-662-11661-6
File Type
pdf
File Size
3.1 MiB

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