Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
- Author
- American Society of Mechanical Engineers. Applied Mechanics Division.et al
- Publisher
- American Society of Mechanical Engineers
- Language
- English
- Year
- 1994
- Page
- 336
- ISBN
- 0791814491,9780791814499,0791814270,9780791814277,0791814424,9780791814420
- File Type
- pdf
- File Size
- 35.6 MiB
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