Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly and applications for injection molded circuit carriers
- Author
- Jörg Franke
- Publisher
- Hanser Gardner Pubns, Elsevier Inc
- Language
- English
- Year
- 2013
- Page
- XII, 356 S. : Ill., graph. Darst
- ISBN
- 978-1-56990-551-7,978-1-56990-552-4,1569905517,1569905525
- File Type
- pdf
- File Size
- 14.5 MiB
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