Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
- Author
- Qingke Zhang (auth.)
- Publisher
- Springer-Verlag Berlin Heidelberg
- Language
- English
- Edition
- 1
- Year
- 2016
- Page
- XV, 143
- ISBN
- 978-3-662-48821-8,978-3-662-48823-2
- File Type
- pdf
- File Size
- 7.3 MiB
How to Download?!!!
Just click on START button on Telegram Bot