ISTFA 2003 Proceedings of the 29th International Symposium for Testing and Failure Analysis, 2-6 November 2003, Santa Clara Convention Center, Santa Clara, California

This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis. The CD-ROM presents the complete content of the book in fully searchable Adobe Acrobat PDF format. Contents: Fault Isolation of the Electrical Fail over Sample Presentation; Imaging and Material Analysis; Failure Analysis Process Flows on Individual Components; System-Level Performance; Manufacturing yield Enhancements; Packaging Issues and Solutions; Hot Topics such as Optical Probing and Tester-Driven Failure Analysis.