Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
- Author
- E-H Wong, Y.-W. Mai
- Publisher
- Woodhead Publishing
- Language
- English
- Edition
- 1
- Year
- 2015
- Page
- 482
- ISBN
- 1845695283,9781845695286
- File Type
- pdf
- File Size
- 18.6 MiB
How to Download?!!!
Just click on START button on Telegram Bot