3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
- Author
- Ibrahim (Abe) M. Elfadel, Gerhard Fettweis (eds.)
- Publisher
- Springer International Publishing
- Language
- English
- Edition
- 1
- Year
- 2016
- Page
- XXIII, 339
- ISBN
- 978-3-319-20480-2, 978-3-319-20481-9
- File Type
- pdf
- File Size
- 16.3 MiB
How to Download?!!!
Just click on START button on Telegram Bot