3D Microelectronic Packaging: From Fundamentals to Applications
- Author
- Yan Li, Deepak Goyal (eds.)
- Publisher
- Springer International Publishing
- Language
- English
- Edition
- 1
- Year
- 2017
- Page
- IX, 463
- ISBN
- 978-3-319-44584-7,978-3-319-44586-1
- File Type
- pdf
- File Size
- 20.9 MiB
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