Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
- Author
- Xing-Chang Wei
- Publisher
- CRC Press
- Language
- English
- Edition
- 1
- Year
- 2017
- Page
- 340
- ISBN
- 1138033561,9781138033566
- File Type
- pdf
- File Size
- 12.7 MiB
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