3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility
- Author
- Horng, Tzyy-sheng JasonHwang, Lih-Tyng
- Publisher
- John Wiley & Sons
- Language
- English
- Edition
- 1st edition
- Year
- 2018
- ISBN
- 9781119289678,9781119289661,9781119289647,1119289645
- File Type
- pdf
- File Size
- 12.0 MiB
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